COB, GOB, SMD and MIP LED Packaging: Technical Differences and Application Guidance

Four LED packaging technologies (SMD, COB, GOB, MIP) are used in display products today. This article explains what each technology actually is at the component level, their real advantages and limitations (not marketing slogans), and practical guidance on where each is appropriate. Overview Focus: optical emission, viewing angle, reflectivity, peak brightness, thermal limits, serviceability, pitch scalability and supply-chain maturity. Key numeric references: Typical production COB peak brightn